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Our packaging equipment is the mainstream imported equipment, fully complying with visual management and automotive packaging requirements. We have abundant experience in mass production of multi-layer chip packaging and heterogeneous integration (SiP).

We are equipped with advanced analysis and detection equipment for mass production: ultrasonic scanners, X-RAY perspective detectors, push-pull strength testers, high-precision measuring microscopes, and coating thickness testers.

We have a failure analysis and reliability laboratory, capable of independently completing failure analysis at the packaging level.

The introduction of new products and mass production are based on the PLM and MES systems, which manage the entire product lifecycle.

For automotive packaging products, in addition to meeting the electrical traceability requirements of UID, we are already fully capable of meeting more stringent physical traceability requirements (S/N by unit).