● Our packaging equipment is the mainstream imported equipment, fully complying with visual management and automotive packaging requirements. We have abundant experience in mass production of multi-layer chip packaging and heterogeneous integration (SiP).

● We are equipped with advanced analysis and detection equipment for mass production: ultrasonic scanners, X-RAY perspective detectors, push-pull strength testers, high-precision measuring microscopes, and coating thickness testers.

● We have a failure analysis and reliability laboratory, capable of independently completing failure analysis at the packaging level.

● The introduction of new products and mass production are based on the PLM and MES systems, which manage the entire product lifecycle.

● For automotive packaging products, in addition to meeting the electrical traceability requirements of UID, we are already fully capable of meeting more stringent physical traceability requirements (S/N by unit).