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WAFER Packaging

Equipment Used: ASM's newest die bonder, gold wire bonder, auto trim-form system, and high speed auto testing and sorting handler; analysis and detection equipment include ultrasonic scanners, x-ray detectors, bonding tension testers, high-precision three-dimensional measuring microscopes, and coating x-ray thickness gauge;
Engineering Ability: Ultrasonic Scan, X-Ray;
Production capability: gold and copper wire (SOP8/ESOP8/SOP16); QFN and BGA will be available soon.